The scalability of our processes allows us to ramp production quickly for high volume applications such as mobile handsets. Lens wafers are made on glass substrates carrying large arrays of lenses which are formed by the Anteryon’s replication technology. In between the wafers Anteryon places in-house powder blasted glass substrates which are used as spacers.

The wafers are then stacked in a multilayer package to form a complete fully focused optical assembly ready for bonding to a light sensor such as a CMOS wafer or a light source such as a VCSEL wafer.

Options:

• lens replication on both sides of a single wafer
• stacked wafers to create high end solutions with up to 8 optically active surfaces
• integrating of filters
• integration of diaphragms
• spacer layers
• interface mounting face layer to the light sensor / source

The total package is compact, ready for integration to a full imaging sensor package without additional assembly steps.

An additional bottom spacer aligns the lens (array) in vertical direction eliminating the need for focussing.

Our WaferOptics® camera objectives are robust and reliable to levels suitable for arduous environment applications. Our camera modules are reflow solderable and SMA and Telcordia compliant.

The WaferOptics® technology is expected to dominate the camera modules lens system market in the near future.