Wafer scale manufacturing process enables the production of a large volume of optical elements on a single glass wafer. These micro optical elements can be refractive such as (a)spherical, (a)cylindrical or free-form lenses or diffractive optical elements so called DOE’s.

Replication on glass wafers increases temperature stability and enables reflow soldering.

Design flexibility can be increased by using both sides of the glass wafer.

Costs of for example VCSEL lasers or CMOS image sensors might be reduced even further by eliminating the glass plate by replicating the optical elements directly on top of electro optical wafers.

Reflowabililty enables customers to automatically mount and solder the camera or laser in batch process to the printed circuit board. The cost advantage is enormous by reduction of labour costs and process time.

WaferOptics® naturally follows the semiconductor roadmap. Smaller pixel sizes, smaller dimensions enable lower cost per sensor or laser. Smaller sensor or laser sizes require smaller optics, thereby allowing more lenses per optical wafer, and thus lower cost per lens.

Please ask Anteryon to help you converting your current design to a WaferOptics® solution.